Methodology: We collected most relevant posts on LinkedIn talking about Black Hat Europe 2025 and created an overall summary only based on these posts. If you´re interested in the single posts behind, you can find them here: https://linktr.ee/thomasallgeyer. Have a great read!

If you prefer listening, check out our podcast summarizing the most relevant insights from CES 2026:

AI compute and semiconductors shape the on-device agentic era

  • NVIDIA is positioned as driving the next platform cycle, with CES narratives referencing the Rubin platform and a broader “Vera Rubin” system storyline

  • Intel showcased Core Ultra Series 3, previously known as Panther Lake, emphasizing performance, power efficiency, and AI-native computing

  • Qualcomm expanded its IoT portfolio while reinforcing its robotics positioning in CES coverage

  • MediaTek’s Filogic 8000 chips were highlighted as early steps toward Wi-Fi 8 readiness

  • Across PCs, OEM laptops from Acer, ASUS, Dell Technologies, HP, Lenovo, Microsoft, and Samsung were referenced in a shared AI compute context

Robotics and Physical AI move from models to acting systems

  • NVIDIA’s keynote narrative consistently framed “Physical AI” as systems that perceive, reason, and act in the physical world

  • Alpamayo was referenced as an open-source AI model family aimed at safer, reasoning-driven autonomous development

  • Multiple posts highlighted a shift from passive response to active planning and decision-making, often using agentic language

  • Robotics positioning was explicitly tied to silicon strategies, particularly within Qualcomm’s CES portfolio narrative

  • Boston Dynamics’ Atlas appeared as a headline robotics reference, framed as advancing toward industrial-grade capability

Automotive and mobility converge around chip-to-car stacks

  • Sony Honda Mobility unveiled the Afeela 1 pre-production EV, positioned as software-first and premium-led

  • Afeela 1 specifications were explicitly cited, including a 480 km range, AWD dual motors, late-2026 deliveries, and pricing from approximately USD 89,900

  • ZF and Qualcomm were described as collaborating on a scalable ADAS stack powered by ZF ProAI and Snapdragon Ride

  • BMW was framed as advancing next-generation vehicle platforms, including a personal assistant and sixth-generation eDrive

  • LG Electronics Vehicle Solution showcased AI-defined vehicles integrating Snapdragon Cockpit Elite and aiMotive

  • HERE Technologies highlighted AI-powered mapping aligned with Snapdragon Ride for connected cockpit experiences

  • NVIDIA and Mercedes-Benz were repeatedly referenced together, signaling acceleration toward higher-intelligence vehicles

XR, spatial, and display innovation redefine interaction surfaces

  • Samsung Spatial Signage was framed as an enterprise debut of glasses-free 3D for hospitality and public environments

  • ASUS ROG was described as partnering with XREAL to deliver AR gaming glasses

  • Rokid launched Display-Free AI Glasses, emphasizing minimal hardware presence

  • Samsung showcased creaseless foldable screen technology within broader CES trends

  • Display innovation was consistently positioned as part of the AI shift, focusing on new interaction surfaces rather than larger screens

Consumer electronics and smart home shift toward agentic experiences

  • Bosch Cook AI was cited as an example of kitchens evolving from smart devices to agentic systems that take initiative

  • LG’s Wallpaper TV was framed as simplifying consumer experience through cable-free design

  • Clicks expanded beyond accessories with the launch of its first smartphone

  • LEGO appeared in CES trend coverage with references to a Lego Smart Brick

  • Wilfa unveiled Performance EvoⒹ, positioned as a notable consumer product reveal

Partnerships emerge as the dominant commercial pattern

  • Chip-to-system partnerships recur across CES narratives, with ZF–Qualcomm and ASUS ROG–XREAL cited explicitly

  • Automotive platform stories increasingly link compute, cockpit, mapping, and ADAS into integrated roadmaps

  • Across categories, CES positioning favors complete, shippable stacks that combine silicon platforms, software layers, and OEM deployment pathways

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